■Qualification -TOEIC Score (670/ May in 2016 ) -English Qualification (2Grade)-2010 -Qualification to handle organic solvent and specific hazardous materials-2008
学歴詳細
Degree:Industrial Chemistry Education:Science University of Tokyo March,1995 I graduated from university.
登録者職歴情報
現在の状況
在職
転職回数
5
業種
電気、電子、半導体
職種
エレクトロニクス、半導体エンジニア
職歴詳細
■Summary of My Job I’m in charge of material development of electric materials for semiconductor such as stack resist material., DSA for the next generation material and participate in development of the thermal cure material at present since 2015. Mainly, demonstration is being performed with the country, Korea ,Taiwan and US manufacturer and constitution development of an ingredient is being performed. It's business that the lithography condition is being made optimization using ACT12/RF Cube with material composition and 12inch Coater. A former profession has an experience for 12 years as a process engineer of a dry etching including a semiconductor device manufacturer (about 8 years) and a semiconductor equipment manufacturer (4 years) via Lam research company and a UMC Japan company etc. I was taking charge of an oxide etching and a metal etching mainly. Of a new product, I start it up and take charge briefly about process improvement, yield improvement and work of a manufacturing technique. A business trip at foreign countries is being also experienced. We assume that I'm good at doing electric material development, and device process development about dry etch process.
■Career History Sep 08 - Present Merck Performance Materials ( AZ Electronic Materials) Co. - ICM-LP (SOX team, Application team, DSA team, Decomposition team; Specialist ) Mar 03 - Aug08 UMC Japan Ltd - Etch process engineer (Chief charge) May02- Feb 03 Actice Ltd - Etch process engineer Nov 00 - May 01 Fujitsu AMD Semiconductor Ltd- Etch process engineer (Chief charge) May 00- Sep 00 Tokyo Electron Ltd FPD Etch process engineer (Chief charge) Jun 99 - Apr 00 UMC Japan Ltd - Etch process engineer( Chief charge) Apr 95 - May 99 Lam Research Ltd - Etch process engineer
■Core Skill -Constitution development of semiconductor electronic material (multiple resist material, DSA material composition development and sacrificial film material composition development) -Semiconductor etching process technology (oxide etching, metal etching and poly etch process) -Organic solvent removal process after semiconductor etch process (EKC/C30), it's started-up and gained yield by process improvement. -Process development of a semiconductor device(Flash/Logic device etc), process improvement and yield improvement -Repairing improvement of semiconductor manufacturing equipment, maintenance work, equipment introduction start-up and customer support work
■Handled tool Coater : ACT 12(TEL 12inch Coater), RF Cube (Sokudo 12inch Coater) TEL Mark7/Mark8 Lithotech Coater Stepper: I line Stepper for lithography Metal Etch : TCP9600PTX/ SE, Centura DPS Poly Etch： Kiyo poly etcher(12inch etcher), TCP9400PTX/SE Oxide Etch： Tactras(12inch etcher), Unity DRM, Unity IEM, TE8500, Centura Super-e/ eMAX/ Mxp+ Wet Station: PR-200Z, UW8000series for polymer removal after etch Wash tool; Synergy for wash tool after CMP Ashing tool; tool equipped with 9600 tool, Matoson asher Measurement: Hitach cross section SEM/ CD SEM/Tilt-SEM, KLA-tencol Thickness, KLA defect tool etc
■Achievement - Succeeded in transferring it into underlayer of customer wafer(=Si trench/ undercarbon) using mask materials with Si for multi mask materials (= customer; Korea／US) - Contributed to a start-up for a DSA project by condition establishment of Lo size judgment for DSA guide pattern making and customer shipment judgment and contributes to the quality judgement which offers the material to a customer. This can judge the quality, and can ship a sample to customers. - Contributed to the new projects of AZ Electric Materials (=Merck Performance Materials), made the contract with the customers about some projects. - It's improved in 88% from yield 84% by the evaluation of M1 HM etch condition for 0.15um logic product. - Changed the condition of the Active Nit etch for 0.16um flash product, and the CD uniformity in a part of wafer edge was improved. As the result, the yield was improved from 64% to 84%. - Established the condition of W etch back by TCP9600PTX metal tool from different type of AMAT etch back tool ,and contributed to a productive capacity rise. - Succeeded in establishing the condition of the oxide spacer etch by Super-e from different type of Unity DRM. I’ve contributed to the productive capacity ,and my job rank was promoted to work. - I reduced the cost by final acceptance achievement early in case of TCP9600SE equipment start-up.
■Oversea Experience -Oct,1998 for two weeks/ When I worked for Lam Research, I went to Micron in Boise for business trip because I learned the organization of Lam US customer service and new poly etch system. - Feb, 2010 for a week/ When I worked for AZ Electronic Materials, I went to Calfornia state for business trip because I joined in SPIE for my education. - Sep, 2011 for a week/ When I worked for AZ Electronic Materials, I went to Sematech in Albany for the development of DSA projects. I evaluated the dry development process for DSA. -Mar.2012 for three weeks/ When I worked for AZ Electronic Materials, I went to IMEC in Belgium for business trip because of DSA development project. -June. 2012 for two weeks/ When I worked for AZ Electronic Materials, I went to AZ US to start up etch tool for DSA development project. -May, 2013 for two months plus one week/ When I worked for AZ Electronic Materials, I went to AZ US for DSA development project. I learned DSA process for L/S and C/H application, and also I demonstrated and evaluated lots of things for customer test. - January,2016 for a week/ When I worked for Merck(=AZ Electroric Materials), I went to Taiwan to report the progress of demonstration.
その他（自己アピール）
I believe I can contribute to various semiconductor area and have more confidence on this area.